Besi Records a 43% Surge in Orders for the Fourth Quarter
Dutch semiconductor assembly equipment manufacturer BE Semiconductor Industries has released preliminary figures for the fourth quarter of 2025. Provisional orders are set at approximately 250 million euros, according to the company's statement.
Significant Growth in Fourth Quarter Orders
Fourth quarter 2025 orders reached approximately 250 million euros, the company reports. This performance marks an increase of about 75 million euros compared to the third quarter of 2025, representing a rise of 43%. Year-over-year, fourth-quarter orders have increased by 105% compared to the same period in 2024. The group attributes this quarterly momentum primarily to a widespread increase in bookings by Asian subcontractors for 2.5D data center applications and renewed investment in capacity by major clients in the photonics sector. The group also notes that it recorded the expected orders for its hybrid assembly solutions during the quarter.
Total Orders for the Second Half of 2025
Throughout the second half of 2025, orders totaled approximately 425 million euros, according to the statement. This amount represents a 63% increase compared to the first half of the year. The group, which supplies advanced assembly equipment to the semiconductor industry, notes that its clients mainly include chip manufacturers, assembly subcontractors, and industrial and electronics companies. The company, listed on Euronext Amsterdam under the symbol BESI and whose Level 1 ADRs are traded on the OTC markets under the symbol BESIY, is based in Duiven, Netherlands.
Beyond Orders: Financial Projections for Q4 2025
In addition to orders, the group indicates that revenue, gross margin, and operating expenses for the fourth quarter of 2025 are expected to be at the favorable end of its previous forecasts. BE Semiconductor Industries plans to publish its complete results for the fourth quarter and fiscal year 2025 on February 19, 2026. The company develops, manufactures, and markets advanced assembly solutions for the semiconductor and electronics industries, with a particular focus on wafer-level and substrate-level assembly solutions, the statement specifies.