Valeo and OVH Cloud test an aluminium heat exchanger to cool data centers
Valeo announced, in a press release dated October 7, 2026, that it will present with OVH Cloud the validation status of its thermal exchanger intended for data center cooling at the OCP Global Summit 2026 (Open Compute Project), organized in San Jose from October 12 to 15. The equipment manufacturer is thus transposing its expertise in automotive thermal management towards a non-automotive market, a few weeks after presenting on September 24, 2026 in Haute-Loire electric drone motors without rare earths.
Cooling capacity increased by 38% compared to copper
The technology presented targets cooling modules installed on the rear doors of racks as well as fan walls located at the heart of data centers. According to the validation results communicated by the group, its aluminium heat exchangers offer a 38% increase in cooling capacity and 65% increase in power density compared to conventional copper solutions.
Valeo also reports a 25% reduction in fan power consumption. The group indicates that these performance improvements act on two indicators monitored by operators: energy efficiency (PUE) and carbon efficiency (CUE).
The equipment is presented as suitable for both retrofitting existing installations and equipping new racks. Valeo highlights the increased density of racks linked to artificial intelligence requirements to justify the use of aluminium, which is lighter than copper.
Corrosion resistance validated for over ten years
To address industry concerns about aluminium corrosion, Valeo established an accelerated endurance testing program. Tests conducted on the specific coating developed by the group reached the equivalent of more than 10 years of operation, which corresponds according to Valeo to the standard lifespan of data center infrastructures.
The group is currently extending these tests to the equivalent of 15 years. In parallel, OVH Cloud has been conducting real-world condition tests for several months. Valeo presents these works as ongoing research, intended to pave the way for industrialization of production-grade aluminium infrastructures.
"Over the past two years, we have made significant progress in evaluating aluminium liquid cooling," declared Pascale Herman, Vice President Data Centers & BESS at Valeo. The heat exchanger is part of a broader portfolio that includes Direct-to-Chip (DLC) systems, single-phase and two-phase, for high-density racks, as well as water-free immersion units for Micro-Edge computing applications.
