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Last updated : 15/09/2026 - 16h58
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STMicroelectronics Unveils VL53L9, a 3D Lidar Module for Embedded AI

STMicroelectronics announced on Monday the launch of the VL53L9, an integrated direct 3D depth detection (dToF) LiDAR module, aimed at embedded AI applications in compact systems. The company positions this product as a key step in its strategy to integrate detection systems beyond standalone sensors.


STMicroelectronics Unveils VL53L9, a 3D Lidar Module for Embedded AI

A High-Resolution Sensor for Robotics and Industry

The VL53L9 offers a resolution of 2,268 zones (54×42) with a field of view of 54°×42°, enabling detailed 3D mapping and precise detection of small objects. The module delivers a rate of 100 frames per second, with a detection range of 5 centimeters to 9 meters and a displayed accuracy of 1%. The sensor incorporates STMicroelectronics' proprietary technology in stacked SPAD sensors with backside illumination (BSI), as well as innovative optical elements. Its compact design (12.8 mm × 6.1 mm × 4.6 mm) makes it compatible with a wide range of protective materials and processor architectures.

An Integrated Solution for Embedded AI

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The module is presented as an 'all-in-one' solution incorporating dToF processing on-chip, a dedicated power management circuit, and does not require external calibration. STMicroelectronics emphasizes that this architecture reduces system complexity and allows embedded AI applications to operate on small microcontrollers (MCUs) with limited computing needs. The VL53L9 targets areas of robotics (autonomous navigation, obstacle detection), industrial automation (volume measurement, inventory management), smart buildings (presence detection, people counting), augmented and virtual reality (gesture recognition), as well as health applications (fall detection, monitoring for the elderly).

Mass Production Starting July 2026

The module will enter mass production in early July 2026, with samples and volume deliveries already available for customers worldwide. The VL53L9 supports dual power supply (1.2 V and 3.3 V) and outputs data via MIPI or I3C interfaces. The product is certified as compliant with Class 1 laser safety.



Sector Semi-conducteurs et matériel Semi-conducteurs


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Context

Period
  • Period: T2 2026
Key reported figures
  • Revenue: 3 487 millions de dollars
  • Quarterly revenue: 3 487 millions de dollars
  • Revenue growth: 25,9 %
  • EBITDA margin: 7,7 %
  • Net income: 222 millions de dollars
  • Free cash flow: 75 millions de dollars
Guidance from the release
  • Nous anticipons une accélération de la croissance du chiffre d'affaires au quatrième trimestre, tirée principalement par les programmes engagés auprès de nos clients dans les domaines des data centers IA et de la communication par satellite LEO.
Risks mentioned
  • Le mix produit pourrait affecter la marge brute.
  • Les charges liées aux capacités non utilisées.
  • Des incertitudes sur les tendances industrielles.
Opportunities identified
  • Chiffre d’affaires supérieur à 4 milliards de dollars anticipé pour le quatrième trimestre.
  • Demande solide dans les data centers IA.
  • Amélioration de la visibilité et des signes de contraintes d’offre.
Outlook / guidance
  • Expected revenue: 3 700 millions de dollars
  • Management commentary: Point médian des perspectives pour le troisième trimestre 2026 : chiffre d'affaires net de 3,70 milliards de dollars et marge brute de 37,0 %.

The information presented in this article is provided for informational purposes only and does not constitute an investment recommendation, an incentive to buy or sell a financial asset, or investment advice. Readers are invited to conduct their own research before making any decision.

Investments in the stock market involve risks, including the risk of capital loss. Past performance of an asset or market is no guarantee of future results. Any investment decision should be made taking into account your personal financial situation, objectives and risk tolerance.

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