ASM Launches Vertos Flowable Carbon, a PECVD Carbon Film for 3D Chips
The Dutch semiconductor equipment manufacturer has introduced a new carbon film deposition technology designed for 3D chip architectures. The announcement reflects the group's positioning in wafer manufacturing processes.
A Technology That Combines Gap Filling and Planarization
ASM has launched its XP8 Vertos Flowable Carbon, presented as the first flowable carbon film obtained through plasma-assisted chemical vapor deposition (PECVD). The group indicates that this technology combines gap filling and planarization in a single PECVD process, reducing process complexity and improving topography control. According to the company, the solution aims to meet the requirements of 3D device architectures, applicable to both logic chips and memory. Initial deployment takes place as part of high-volume production.
A Process Positioned Against the Limitations of Conventional Carbon Films
ASM explains that conventional carbon films, used for more than two decades, are reaching their limits in terms of gap filling, topography control and pattern fidelity for modern 3D architectures. The Vertos Flowable Carbon process operates within an integrated PECVD system, eliminating subsequent chemical-mechanical planarization or etch steps. The group cites among the film's properties improved planarization on substrates with varied pattern density, increased thermal stability and selective area deposition characteristics. Hichem M'Saad, Chief Executive Officer, stated that the industry's ability to continue scaling increasingly complex devices depends as much on innovation in materials as it does on architecture and design.
