Valeo and Calyos Join Forces on Chip Cooling for Data Centers and Electric Vehicles

A Memorandum of Understanding for Two Key Sectors

Valeo and Calyos have signed a memorandum of understanding (MoU) aimed at developing and industrializing autonomous and high-performance electronic chip cooling solutions. This collaboration addresses the increasing thermal challenges posed by automotive electrification and the expansion of data centers. The two partners are combining Calyos's expertise in two-phase fluid loop (LHP) technology with Valeo's thermal engineering and global production capacity. The developed systems will be more efficient, compact, maintenance-free, and will offer high reliability compared to traditional solutions.

Automotive Electronics and Centralized Architectures

For the automotive sector, the Valeo-Calyos solution targets the power electronics of onboard chargers (OBC), inverters, and integrated electronic systems, offering autonomous and plug-and-play cooling. It also addresses software-defined vehicles (SDV), characterized by increased centralization of computing units and higher chip power densities. This passive cooling simplifies the overall thermal architecture by eliminating the complexity of traditional distributed liquid cooling loops, while ensuring consistent performance and simplified integration.

Data Centers and Energy Efficiency

The collaboration also targets the rapidly expanding data center market. The acceleration of artificial intelligence leads to an increase in power demand and creates an urgent need to improve thermal efficiency to reduce global energy consumption (PUE optimization). The proposed solution offers optimal energy efficiency without active elements (no fluid pump), allowing for increased power density through direct chip cooling, without restructuring the existing infrastructure. This technology complements Valeo's current portfolio, which includes aluminum heat exchangers, single-phase and two-phase cooling distribution units, and immersion cooling.