Valeo and Calyos Team Up on Two-Phase Cooling for Electronic Chips
Valeo and Calyos announced on Tuesday the signing of a memorandum of understanding to develop and industrialize passive two-phase cooling solutions for electronic chips. This collaboration targets both the automotive sector in electrification and the expanding market of data centers.
A Partnership for Autonomous Cooling of Electronic Components
Valeo, a global leader in automotive technologies, and Calyos, specialists in advanced loop heat pipe (LHP) cooling systems, have signed a memorandum of understanding. This agreement aims to develop and industrialize autonomous and highly efficient electronic chip cooling solutions for mobility and computing.
The two partners are combining Calyos's expertise in two-phase fluid loop technology with Valeo's thermal engineering and global industrial capacity. This collaboration launches a new generation of more efficient passive two-phase systems, which are more compact, easy to integrate, maintenance-free, and highly reliable.
Power Electronics and Software-Defined Vehicles
The Valeo-Calyos solution offers benefits for power electronics, including autonomous cooling of onboard chargers (OBC), inverters, and integrated 'x-in-1' electronic systems. For components located at the rear of the vehicle, it enables energy savings and a significant simplification of the overall thermal architecture.
For software-defined vehicles (SDV), the increasing power densities of centralized chips require optimal thermal dissipation. The solution provides autonomous, compact, and reliable cooling for high-speed processors, eliminating the complexity of traditional distributed liquid cooling loops.
Direct Chip Cooling for Data Centers
Valeo applies its decade-long expertise in automotive thermal management to the expanding data center sector, driven by the acceleration of artificial intelligence. This collaboration targets the growing market beyond mobility.
One of the first joint achievements is a passive two-phase cooling solution, offering energy efficiency without active elements (no pump), ease of retrofit by installing autonomous units per server within a rack to increase power density in direct chip cooling, as well as compactness and reduced risk of leaks due to lower fluid pressure than traditional water cooling systems.
