Riber Secures New Order from 3SP Technologies, Delivery Scheduled for 2027
RIBER, a specialist in molecular beam epitaxy (MBE) equipment, announced on July 9, 2026, a new order from 3SP Technologies for an industrial production platform. The system is to be delivered in 2027.
A Long-standing Client Strengthens Commitment
3SP Technologies, a subsidiary of the O-Net Communications group based in France, has placed an order with RIBER for an industrial passivation platform. This client partner of over twenty years thus reaffirms its trust in the manufacturer's technologies. 3SP Technologies designs and manufactures high-performance optoelectronic components, including III-V semiconductor laser chips, intended for optical telecommunication networks and next-generation Datacom infrastructures.
Capacity Increase for Photonic Components
The new platform will enable 3SP Technologies to increase its production capacity to meet the growing demand for high-performance photonic components used in next-generation optical networking applications. These 980 nm high-power laser diodes are key products for data center interconnections, Hyper-rail systems, and other industrial applications. RIBER specifies that epitaxy is a critical step in the manufacturing of advanced semiconductor devices, directly determining the performance, reliability, and reproducibility of the components.
Expanded Technology Portfolio for Artificial Intelligence
RIBER now offers a complete technology portfolio combining its MBE production platforms dedicated to the manufacturing of lasers and photodetectors with the ROSIE platform, aimed at applications of ultra-fast, low-loss electro-optical modulation. These solutions are designed to meet the industrial requirements of the next generation of photonic chips for artificial intelligence and Datacom infrastructures.
